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Adapters
We have the engineering capability to solve your most challenging packaging/electronic design problems. Let us find your solution and convert the design to a deliverable product within days.
We specialize in innovative IC interconnect solutions for prototype, test and production applications used in BOTH product development and ongoing production.
BGA
Ball Grid Array
LGA
Land grid array
QFN
quad-flat no-leads
PLCC
Plastic leaded chip carriers
TSOP
Thin small-outline package
QFP
quad flat package
SOIC
Small Outline Integrated Circuit